Teledyne Technologies Incorporated provides enabling technologies for industrial growth markets that require advanced technology and high reliability. These markets include aerospace and defense, factory automation, air and water quality environmental monitoring, electronics design and development, oceanographic research, deepwater oil and gas exploration and production, medical imaging and pharmaceutical research.
We are looking for a Yield Engineer to join our team. The ideal candidate will be responsible for collecting, tracking, and analyzing process and metrology data to inform and guide the team’s design and process yield improvement activities. This role also involves direct involvement in device failure analysis and collaboration with team members and contributors across relevant disciplines. The candidate should have experience in semiconductor wafer processing, programming skills, SQL database query experience, statistical process control, failure analysis, and yield improvement methods. Other desired experience includes wafer processing, vacuum technology, infrared imaging, and hermetic packaging. The candidate must have a BS in engineering or a science, with an MS preferred, and at least 2 years of experience as a Process, Design, Quality, or Manufacturing Engineer. US citizenship or permanent resident status is required. The salary range for this position is $89,100.00 - $149,600.00. Teledyne is an Equal Opportunity/Affirmative Action Employer, committed to conducting business with the highest ethical standards.
Responsibilities:
- Collect, track, and analyze process and metrology data
- Inform and guide the team’s design and process yield improvement activities
- Direct involvement in device failure analysis
- Collaborate with team members and contributors across relevant disciplines
- Utilize programming skills in Python, Matlab, R, JMP, or similar
- Conduct SQL database query experience
- Apply statistical process control (SPC)
- Utilize structured problem-solving methods (Kepner Tregoe, DMAIC, 8D, 6-sigma, etc.)
- Apply design of experiments (DOE/ANOVA)
- Utilize optical microscopy, SEM/FIB, profilometry, ellipsometry, X-Section, wafer stress, and other elemental analysis methods
- Apply fault isolation techniques (FIBedit, OBIRCH/TIVA, IR, & curve trace)
- Work in cleanroom environment
