Kevin Rose

President & CEO

TAP Engineering

Jan 2021 - Current (5 years 7 months)

Vice President - Product Management

Parsons Corporation

Nov 2019 - Jan 2021 (1 year 3 months)

Led a company-wide product management function spanning Parsons' product lines including sensors and electromagnetic warfare, cyber and SIGINT, ISR/multidomain, space solutions, law enforcement, transportation, and training.

Senior Director - Cyber & SIGINT

Parsons Corporation

Feb 2019 - Oct 2019 (9 months)

• Executive Leadership Training: One of eight Parsons employees nominated and selected to serve a 1-year term on the Parsons Leadership Council, a rotational executive leadership training program leveraged by the Parsons Executive Leadership Team to evaluate special projects related to increasing net margins. • Strategy, Business Development & Capture: Develop and manage growth strategy and business pipeline for ~$80M/yr program directorate. Support business development, capture and proposal writing/ management activities for various prime and subcontracting opportunities as required. • Operations: Acted as Deputy Program Director for ~$120M+/yr (200+ FTE) program portfolio for 4 month rotation during reorganization transition. Managed/opti

Director - Business Development

Parsons Corporation

Apr 2017 - Jan 2019 (1 year 10 months)

• Business Development & Capture: Responsible for developing and executing business development function with a goal of >10% year-over-year overall revenue growth. Activities include: building/managing sales pipeline; shaping customer opportunities; conceptualizing/writing technical whitepapers; evaluating customer procurement forecasts; evaluating bid/no-bid & prime/sub decisions; developing/executing capture strategies; negotiating teaming arrangements; proposal management/writing; corporate marketing; managing BD budget/team. Result: >20% year-over-year growth (2018 Size: ~$35M/year revenue) • Program "P": Supported capture of a 5-year/ $240M DoD hardware & embedded software development program. Activities included: assisting developme

Senior Microelectronics Engineer

Parsons Corporation

Jun 2014 - Mar 2017 (2 years 10 months)

• Quick Reaction Contract (QRC) Engineer: Task Lead for small (5-20 person) integrated product teams (IPTs) focused on the quick-turn reverse engineering, design, manufacture and test of custom, embedded, microelectronic hardware solutions for the DoD. Solutions focused on low power, short-range wireless communication hardware nodes and relay points including custom digital, analog and RF circuitry. Technical focus areas: electronics packaging, microelectronics, hardware reverse engineering, 3D CAD design, analysis & test, material selection/qualification, low-volume prototyping/production. • Printed Electronics: Conceptualized, captured and led a 1 year/ ~$2M DoD sole source effort for the development of cutting-edge additive manufacturing

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Mechanical Engineering Group Manager / Program Manager

Engineering Vision Innovation LLC

Oct 2010 - Jan 2013 (2 years 4 months)

Served in a dual-role as the Mechanical Engineering Group Manager and Program Manager • Mechanical Engineering Group Manager: Managed a group of ~20 mechanical engineers, drafters and technicians within a matrix organization across multiple programs at sites across Maryland, Virginia, and Pennsylvania. o Responsible for interfacing with programs and other functional departments within matrix to ensure that Mechanical Engineering Department met the needs of all EVI Programs. o Responsible for supervision, training and development, hiring, compensation, and disciplinary actions for mechanical engineering staff. o Responsible for managing department budgeting, which included: department-related IRAD, capital expenditures, and annual raises/bon

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Senior Mechanical Engineer / Technical Program Manager

Engineering Vision Innovation LLC

Oct 2007 - Oct 2010 (3 years 1 month)

• Microelectronics Design & Manufacturing: Lead Mechanical Engineer and Project Manager for microelectronic packaging development and manufacturing efforts to support cleared DoD programs with a focus on wireless communication hardware nodes and relay points. Principal investigator for technical feasibility studies and white papers. Technical focus on microelectronic packaging, reverse engineering, thermal design & qualification, plastics molding, manufacturing/prototyping, QRCs • Project “D”: Principal investigator for a ~$40K IRAD effort to develop a next-generation digital architecture which offered reduced package volume by >40% and increased performance (processing speed, memory, thermal) over the existing solution. Successfully captur

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Mechanical Engineer

Aerotek placed at Engineering Vision Innovation LLC

May 2007 - Oct 2007 (6 months)

• Electronics packaging engineer supporting the design of PCBs and associated mechanical enclosures, test fixtures and fabrication/assembly jigs for various DoD programs.

Mechanical Engineer

Northrop Grumman

Feb 2006 - May 2007 (1 year 4 months)

• QRC Mechanical Engineering, Electronic Packaging: Reverse engineer, design, manufacture and test of embedded hardware systems for DoD programs on compressed schedules. Focus on wireless communication hardware nodes and radar systems. • Project “Z”: Supported layout of an electronically scanned array (ESA) radar and radome affixed to the belly of a small commercial aircraft. Performed preliminary structural and thermal analyses on system. • Project “R”: Supported layout of a wireless communication node by integrating pre-manufactured microelectronics hardware solution with larger system. Other challenges included printed circuit board design, thermal and structural analysis, vacuum cast molding.

Engineering/Manufacturing Intern

Northrop Grumman

Feb 2001 - Jun 2002 (1 year 5 months)

• Assisted in the design of mechanical components for avionics electronics systems • Supported a six sigma lean initiative to optimize throughput through an electronics assembly line

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