B

Ben Regev

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VP, Hardware Engineering
Boca Raton, Florida, United States

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Résumé


Jobs verified_user 0% verified
  • Flock
    VP, Hardware Engineering
    Flock
    Jan 2025 - Current (1 year 8 months)
  • Flock
    Senior Director, Hardware Engineering
    Flock
    Mar 2024 - Jan 2025 (11 months)
  • Flock
    Director, Hardware Engineering
    Flock
    Oct 2022 - Mar 2024 (1 year 6 months)
  • Qualcomm
    Principal Hardware Engineer Manager, Customer Engineering
    Qualcomm
    Nov 2018 - Oct 2022 (4 years)
    -Managing a team of hardware engineers responsible for all North American customer support and product commercializations across IoT, XR/AR, Computing, and Consumer Electronics product segments. -Overseeing successful launches of many market leading consumer products such as: Smartphones and tablets, HMDs, AR glasses/viewers, smart watches, connected cameras, smart assistant and smart home devices, drones, toy/service/ground robots, Streaming devices, etc... -Contributing to the roadmap, strategic, and technical solution discussions and decision-making process in each of the relevant product segments -Supporting Business Unit leads with new customer engagements and product requirement definitions -Supervising the generation of reference de
  • Qualcomm
    Senior Staff Engineer/Manager - IoT HW Applications Engineering
    Qualcomm
    Nov 2010 - Nov 2018 (8 years 1 month)
  • A
    Senior Hardware Applications Engineer, Manager
    Altair Semiconductor
    Jan 2008 - Nov 2010 (2 years 11 months)
    -Established and managed the application engineering group, reporting to VP marketing -Led customer support activities, first on WiMAX products, and later on Altair's first single-mode LTE Chipset offering -Worked closely with engineering leads and marketing in identifying and prioritizing key customer requirements, thereby enabling initial successful commercializations of Altair's solution
  • Qualcomm
    Senior Engineer
    Qualcomm
    Feb 2004 - Jan 2008 (4 years)
    -HW support lead for the industry's first single chip solution: QSC60x0 -Close interaction with Product Management and project leads, enabling the successful launch of many phones across global markets -HW support of multimedia and camera issues across customers and product segments
Education verified_user 0% verified
  • University of Pittsburgh
    Master’s Degree, Electrical, Electronics and Communications Engineering
    University of Pittsburgh
    Jan 1998 - Jan 2003 (5 years 1 month)
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