Remi Glemet
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Firmware Engineer at VergeSense
Valbonne, Provence-Alpes-Côte d'Azur, France
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Résumé
Jobs
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Validation EngineerNXP SemiconductorsJan 2024 - Current (2 years 10 months)• Pre and Post Silicon validation for ARMv8-based SoCs in a Linux environment
• Performed functional validation of digital IPs within a cross-functional team: - Developed 50+ testcases and provided results driven by metrics-based methodology, frame characterization and features verification - Validation planning and reporting to FVAL team - International & multi-cultural context (India, China, USA) - Led debug processes in collaboration with design and verification teams including root-cause analysis and metrics reporting
• Knowledge in peripheral, timers, system and inter-core IPs: Low-power SPI, UART, WDOG and interrupt timer, ROM controller, DMA, Message Interrupts and semaphore- Firmware EngineerVergeSenseMar 2023 - Sep 2023 (7 months)• Installed and configured a sensor network using Linux command-line and JTAG interfaces
• Ran side by side analysis of network performances and advantages
• Tested the stack update of Wirepas 5 by using Hex and Sisense (Python and SQL)
• Created and developed tools and dashboards for analyzing data from our clouds (using RSSI, images, logs, travel time) - Hardware EngineerBioSerenityMay 2022 - Sep 2022 (5 months)• Conducted comparative light performance tests of Intermittent Photic Stimulation (IPS) by using a spectrophotometer.
• Executed consumption tests and then optimized PCBs
• Prototyped control unit and power supply board based on product specifications, medical standards NE 60601-1, software requirements and component availability
• Designed electronic parts (Altium Designer)
• Prepared, documented, and presented technical reports. - InternUniversiti Kuala LumpurApr 2019 - Jun 2019 (3 months)• Led a robotic project with the objective of improving it
• Simulated electronic modules with Proteus
• Developed a robot under Arduino (UNO & NANO) connected with an RF module allowing to drive motors remotely
• Designed body parts in 3D CAD (Solidworks)
• Prototyped, purchased and assembled components and electronic parts
• Presented final internship deck to Director of organization
Education
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- Ecole nationale supérieure de l'Electronique et de ses Applications — Master Degree in Computer Science Embedded SystemsEcole nationale supérieure de l'Electronique et de ses ApplicationsJan 2020 - Dec 2023 (4 years)Mathematics Applied to Electrical Engineering (analyzed and signal processing) Engineering Physics (electromagnetism, quantum, thermic), Microelectronics, Digital and Analog Electronic Processing and Design, Experimentation & Measurements, Embedded Systems Engineering, Robotics, Intro. to Mechanical Behavior of Engineering Materials, Management and Organization of Project, Statistics and Probability, Automatics Systems, Energy Production and Engine Operation.
- master, Master Degree in Computer Science Embedded Systems and Electrical EngineeringEcole nationale supérieure de l'Electronique et de ses ApplicationsJan 2020 - Jan 2023 (3 years 1 month)
- LLYCEE GUSTAVE EIFFEL BORDEAUX — Mathematics Physics Mechanical and Electrical EngineeringJan 2019 - Dec 2020 (2 years)
- Mathematics Physics Mechanical and Electrical EngineeringLYCEE GUSTAVE EIFFEL BORDEAUXJan 2019 - Jan 2020 (1 year 1 month)
- Université de Poitiers — Technical Degree in Electrical EngineeringUniversité de PoitiersJan 2017 - Dec 2019 (3 years)
- Technical Degree in Electrical EngineeringUniversité de PoitiersJan 2017 - Jan 2019 (2 years 1 month)